Packaging Development Program Manager, Semiconductors

  • Location


  • Sector:

    Engineering & Manufacturing

  • Job type:


  • Salary:

    S$6500 - S$9000 per month

  • Contact:

    Abhik Damani

  • Contact email:

  • Job ref:


  • Published:

    about 1 year ago

  • Expiry date:


  • Consultant:


My client is a global name in the semiconductor and packaging industry and now seek an experienced Packaging Program Development Manager

  • World Leader
  • Innovative Technology
  • High Salary


  • Develop and implement packaging design rules and other specifications for module assembly process
  • Manage technical program in developing materials and assembly process by providing technical risk assessment
  • Perform material related benchmarking & technology surveys
  • Develop and implement laminate, flipchip bumping and assembly design rules
  • Lead new product introduction of packages in different assembly factories, validate the materials, process parameters using DOE methodology, and establish necessary process controls and monitors
  • Provide material related technical solution and guideline to the team
  • Achieve the target assembly yields & quality requirement during development stage with DFM solution
  • Qualify new products coordinating the required package level and board level reliability testing with the quality and reliability group and conduct failure analysis


  • Advanced degree in engineering or material science with at least 10-15 years of assembly experience using laminate substrate for CSP product or equivalent
  • At least 5-7 years of mold process experience on laminate package through transfer/compression mold technology
  • Experience in process development and improvement
  • Prior knowledge in design and development of new packages
  • Familiarity with flip chip process and semiconductor packaging technologies
  • Qualify the designed package, materials and processes through reliability stress testing
  • Stronghold with thermal and mechanical material properties of mold compound
  • Experience in reliability/failure analysis will be an added advantage
  • Experience in System in Package (SIP) module and general assembly processes

Please send your resume in WORD format by clicking the apply button below or contact Abhik Damani on +65 6701 1527 for a confidential discussion. Please note that only short-listed candidates will be contacted. CEI Reg. Number R1544061 (Abhik Damani).