Hybrid Bonding Engineer (Process Development/Application)

  • Location


  • Sector:

    Engineering & Manufacturing

  • Job type:


  • Salary:

    S$4000 - S$6000 per month

  • Contact:

    Abhik Damani

  • Contact email:


  • Job ref:


  • Published:

    11 months ago

  • Expiry date:


  • Consultant:


My client is one of the largest names in the semiconductor industry and now seek an experienced Hybrid Bonding Engineer focusing on Process Development and Application Support


Process Development and Support

  • Collect Process Data related to Hybrid Bonding
  • Define DOE's and experimental process trials
  • Document and prepare reports
  • Understand the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
  • Acquire knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
  • Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions

Machine & Applications Support

  • Machine installation/application setup and calibration
  • Define Tooling and Collaterals together with Engineering team
  • Prepare and execute customer demos and sample builds
  • Roll out new software, features set and modules


  • Master or PhD in Physics, Semiconductor or Electronics with 5 years' experience in a complex R&D environment
  • Minimum 5 years of experience in a complex Technical environment, 3years in R&D environment
  • Solid experience within semiconductor front and backend process R&D
  • Exposure to a production environment considered an asset
  • Excellent knowledge of Metrology and semiconductor physics
  • Matlab, JMP, statistical skills and experience with programming will be a plus
  • Ability to negotiate and manage internal and external stakeholders

Please send your resume in WORD format by clicking the apply button below or contact Abhik Damani on +65 6701 1527 for a confidential discussion. Please note that only short-listed candidates will be contacted. CEI Reg. Number R1544061 (Abhik Damani).