My client is one of the largest names in the semiconductor industry and now seek an experienced Hybrid Bonding Engineer focusing on Process Development and Application Support
Responsibilities:
Process Development and Support
- Collect Process Data related to Hybrid Bonding
- Define DOE's and experimental process trials
- Document and prepare reports
- Understand the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
- Acquire knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
- Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions
Machine & Applications Support
- Machine installation/application setup and calibration
- Define Tooling and Collaterals together with Engineering team
- Prepare and execute customer demos and sample builds
- Roll out new software, features set and modules
Requirements:
- Master or PhD in Physics, Semiconductor or Electronics with 5 years' experience in a complex R&D environment
- Minimum 5 years of experience in a complex Technical environment, 3years in R&D environment
- Solid experience within semiconductor front and backend process R&D
- Exposure to a production environment considered an asset
- Excellent knowledge of Metrology and semiconductor physics
- Matlab, JMP, statistical skills and experience with programming will be a plus
- Ability to negotiate and manage internal and external stakeholders
Please send your resume in WORD format by clicking the apply button below or contact Abhik Damani on +65 6701 1527 for a confidential discussion. Please note that only short-listed candidates will be contacted. CEI Reg. Number R1544061 (Abhik Damani).
